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A CMOS compatible polycrystalline silicon-germanium based piezoresistive pressure sensor

机译:CMOS兼容多晶硅锗基压阻式压力传感器

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This paper presents for the first time a piezoresistive poly-SiGe pressure sensor processed at temperatures compatible with above-CMOS integration. Despite the low processing temperature (max. 455°C), a sensitivity of 5.8mV/V/bar for a membrane of 200×200 µm2 is reached by piezoresistor design optimization. The possibility of further enhancing the piezoresistive properties of SiGe by tuning annealing time is investigated, leading to a 30% improvement in gauge factor.
机译:本文首次提供了在与上方CMOS集成兼容的温度下加工的压阻性聚光压力传感器。 尽管加工温度低(最大455° c),但对于200× 200µ m 2 的膜的5.8mV / v / r棒的灵敏度为5.8mV / v / r型。压电电阻 设计优化。 研究了通过调节退火时间进一步增强SiGe压阻性能的可能性,导致测量因子的提高30%。

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