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A CMOS compatible polycrystalline silicon-germanium based piezoresistive pressure sensor

机译:CMOS兼容的多晶硅锗基压阻式压力传感器

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This paper presents for the first time a piezoresistive poly-SiGe pressure sensor processed at temperatures compatible with above-CMOS integration. Despite the low processing temperature (max. 455°C), a sensitivity of 5.8mV/V/bar for a membrane of 200×200 µm2 is reached by piezoresistor design optimization. The possibility of further enhancing the piezoresistive properties of SiGe by tuning annealing time is investigated, leading to a 30% improvement in gauge factor.
机译:本文首次提出了在与以上CMOS集成兼容的温度下进行处理的压阻式多晶硅SiGe压力传感器。尽管加工温度较低(最高455°C),但通过优化压电电阻设计,对于200×200 µm 2 的膜仍可达到5.8mV / V / bar的灵敏度。研究了通过调整退火时间进一步增强SiGe压阻特性的可能性,从而使规格系数提高了30%。

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