Dry-reeds operating in the range of micropower loadings indicate a significant part of parametric failure i.e. resistance increasing and it's instability. The carried out investigations confirmed the leading role of physical adsorption and its influence on the speed of dry-reed contact resistance increase. This type of failure process is described by a model connecting a contact topography, dynamics of insulating films growing with the speed of resistance increase. The model was worked out at the basis of Gumbel statistics. Dry-reed relays reliability tests fully confirmed the validity of the proposed model. The presented solutions are the basis for the quick element quality estimation and surface phenomena dynamics.
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