Research on Double Sided Polishing Technology for Silicon Wafer

摘要

Double sided polishing is one of the main processes to access ultra-smooth surface of semiconductor wafers. This paper introduces the key technologies of developing double sided polishing machine for 4" wafers, and analyzed the polishing processes for 4" Si wafers base on the machine developed. Experiment results showed that the equipment can finish a batch 4" Si wafers (thickness 0.5mm) in 40 minutes, the average removal rate is 0.25μ/min, and the surface quality can reach Ra 0.401nm, GFLD ±1.63μm.