IMPROVING IC RELIABILITY BY REDUCING CHIPPING DEFECT IN DICING SAW PROCESS

摘要

Dicing Saw is one of the important processes in Integrated Circuit manufacturing. Its performance is very critical to IC quality, especially on the reliability. Die chipping is a potential failure mode in Dicing Saw process. Die chipping can lead to circuit deformity or die scratch in dicing saw or die bonding processes. The potential effects of die chipping failure are electrical failure and IC reliability. The potential causes and mechanisms of failure are diversiform. Although its occurrence in IC production is very low, its severity is high. IC final manufactures have to pay more attention to reduce the risk of die chipping defect. Comprehensive studies on reducing chipping defects in dicing saw technology are elaborated in this paper to achieve robust IC manufacturing.