The Effect of Deposition Time on the Voltage Range and Sensitivity of Cu/Ni as Low-Temperature Sensor Resulted from Electroplating Assisted by a Transverse Magnetic Field

摘要

The Cu/Ni thin film as low-temperature sensor was produced by electroplating on the various deposition times assisted with a 200G magnetic field in the transverse direction to the surface of Cu. The deposition time was varied from 0 to 45s. The liquid nitrogen (LN2) 0°C to -200°C was used as a tested low-temperature medium. The characterization was done on the voltage range and sensitivity. Cu/Ni sensor from deposition within 25s has the largest voltage range that is 128.48 mV and has the sensitivity (S) that has a linear relationship with temperature (7) according to S(T) = 0.287 - 0.0027.