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First-Principles Study on Electronic, Mechanical and Thermoelectric Transport Properties of Topological Insulator NaAuS

机译:拓扑绝缘体Naaus电子,机械和热电传输性能研究的第一原理研究

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We have investigated the mechanical, electronic and thermoelectric transport properties of material using density functional theory. Our calculated results predict that NaAuS is elastically and thermodynamically stable material. We have calculated band gap of 0.15eV for this material using PBE functional including spin-orbit coupling (SOC). Band inversion at gamma point indicates about the topological behavior of material. The calculated value of power factor and Seebeck Coefficient is 8.874x10~(11) W/msK~2 and 140.42 μV/K, respectively; at T=1000K. Lattice thermal conductivity which plays a significant role in thermoelectric efficiency of a material, is found to be 5.62 W/mK at T=300K. The lattice thermal conductivity of this material decreases with increase in temperature. The figure of merit (ZT) comes out to be 0.79 at T=1000K, thus this material can act as good thermoelectric material.
机译:我们研究了使用密度函数理论的材料的机械,电子和热电传输性能。我们计算的结果预测Naaus是弹性和热力学稳定的材料。使用PBE功能,包括包括旋转轨道耦合(SOC)的PBE功能,为此材料计算了0.15eV的带隙。伽马点的频段反转表明了材料的拓扑行为。功率因数和塞贝克系数的计算值分别为8.874x10〜(11)W / MSK〜2和140.42μV/ k;在t = 1000k。在T = 300K中发现在材料的热电效率中起显着作用的晶格导热率在材料的热电效率下起到5.62W / mk。这种材料的晶格导热率随温度的增加而降低。优选(ZT)的数字在T = 1000K处出现0.79,因此该材料可以充当良好的热电材料。

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