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Electrostatic Charges and Ion Implantation Impact on the MIS Transistors Parameters Degradation

机译:静电电荷和离子注入对MIS晶体管参数的影响降解

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摘要

Resistance to electrostatic charges is one of the most important problems limiting the very large scale integrated circuits reliability. Increased currents cause the degradation of the instruments characteristics, similar to the degradation that occurs when hot electrons stream passes through. In order to increase the very large scale integrated circuits reliability, under hot electrons occurrence, exposure to ionizing radiation, electrostatic charges, and ion treatment, it is necessary to study the MIS transistors parameters degradation mechanisms. The results of the study show that the maximum the threshold voltage shift occurs when aluminum is sprayed onto the structure with a floating gate. The reason for the MIS transistors characteristics degradation is the charges of the gate electrode and the current in the oxide arising from strong electric fields. The degree of characteristics degradation in the hot electrons injection case does not depend on the energy of the ions bombarding the substrate surface.
机译:抵抗静电电荷是限制大规模集成电路可靠性的最重要问题之一。增加的电流导致仪器特性的降解,类似于热电子流通过时发生的劣化。为了提高大规模的集成电路可靠性,在热电子发生下,暴露于电离辐射,静电电荷和离子处理,有必要研究MIS晶体管参数劣化机制。研究结果表明,当铝用浮栅喷射到结构上时,发生阈值电压移位的最大值。 MIS晶体管特性劣化的原因是栅电极和由强电场产生的氧化物中的电流的电荷。热电子注射箱中的特性降解的程度不依赖于轰击基材表面的离子的能量。

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