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Investigation of III-V Compound Semiconductor Materials on Analog performance of Nanoscale RingFET

机译:III-V复合半导体材料对纳米级圈模拟性能的研究

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In present work, the impact of channel material engineering and gate oxide engineering on the RingFET architecture has been investigated for the first time. This investigation involves the study of various electrical parameters like drive current (Id-V_(gs)), threshold voltage (V_th), Sub-threshold Slope (SS), Drain Induced Barrier Lowering (DIBL), Ion/I_(OFF), and transconductance generation efficiency (gm/I_d), under different device specifications. Furthermore investigation reveals the performance of III-V group semiconductor devices on RingFET for analog and digital application. Apart from these reliability issues the excessive gate leakage current has also been addressed.
机译:在目前的工作中,首次研究了渠道材料工程和栅极氧化物工程对铃声架构的影响。本研究涉及研究各种电参数,如驱动电流(ID-V_(GS)),阈值电压(V_TH),子阈值斜率(SS),漏极感应屏障降低(DIBL),离子/ I_(关闭),和跨导效率(GM / I_D),在不同的设备规格下。此外,研究揭示了III-V集团半导体器件在RingFET上进行模拟和数字应用的性能。除了这些可靠性问题外,还已经解决了过多的闸门漏电流。

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