Electro-Thermal Analysis and Optimisation of Edge Termination of Power Diode Supported by 2-D/3-D Numerical Modelling and Simulation

摘要

Numerical modelling and simulation provide an efficient tool for analysis and optimization of device structure design. In this paper we present the analysis and the geometry optimization of the power module with high power pin diode structure supported by the advanced 2-D/3-D mixed-mode electro-thermal device simulation. The structure under investigation is P~+NN~+ power diode device designed for high reverse voltages and very high forward currents, with a maximum forward surge current up to 2.7 kA.