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Characterization of ZrN Thin Films Deposited by Reactive DC Magnetron Sputtering

机译:反应性DC磁控溅射沉积的ZrN薄膜的表征

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ZrN thin films were deposited on silicon (1 0 0) wafers and glass slides by reactive DC magnetron sputtering technique. The effects of nitrogen gas flow rate on the crystal structure, morphology and electrical resistivity of the films were investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM) and four-point probe, respectively. The results revealed that the orientation of ZrN structure corresponded to (1 1 1), (2 0 0) and (3 1 1) planes. The (2 0 0) texture coefficient of the ZrN films decreased with increasing flow rate of the nitrogen gas. As the gas flow rate increased, the surface morphology of the ZrN films becomes smoother and the electrical resistivity of the ZrN films increased, ranging from 158 to 3811 μ?·cm.
机译:通过反应性DC磁控溅射技术沉积在硅(1 0 0)晶片和玻璃载玻片上沉积Zrn薄膜。使用X射线衍射(XRD),扫描电子显微镜(SEM)和四点探针,研究了氮气流速对膜的晶体结构,形态和电阻率的影响。结果表明,ZrN结构的取向对应于(111),(2 0 0)和(311)平面。 ZrN膜的(2 0 0)纹理系数随着氮气的流速的增加而降低。随着气体流速的增加,ZrN膜的表面形态变得更光滑,ZrN膜的电阻率增加,范围为158至3811μΩ·cm。

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