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Solder Reliability: Lead-Free Solder

机译:焊接可靠性:无铅焊料

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The worldwide "green" movement in the electronics industry to replace lead-in eutectic solders with lead-free solders creates a need for critical data on the industry's new lead-free solder compositions for these design and reliability models. Members of the Materials Reliability Division are working with members of the Metallurgy Division, the Colorado School of Mines, and the National Electronics Manufacturing Initiative (NEMI) to develop and disseminate such data on lead-free solders.
机译:电子行业的全球“绿色”运动取代与无铅焊料的引入共晶焊料,可以需要对这些设计和可靠性模型的行业新的无铅焊料组合物的关键数据。材料可靠性部门的成员正在与冶金师,科罗拉多省矿山学院和国家电子制造倡议(NEMI)合作,以在无铅焊料中开发和传播这些数据。

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