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Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

机译:酸性溶液中Sn基无铅焊料的腐蚀行为

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The corrosion properties of Sn-9(5A1-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HC1). Sn-9(5A1-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5A1-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HC1).
机译:通过在1M盐酸(HCl)的酸性溶液中通过电位偏振方法研究了Sn-9(5a1-Zn),Sn-Cu和SAC305的腐蚀性能。与Sn-Cu和SAC305相比,Sn-9(5A1-Zn)产生了不同的偏振曲线。形态学分析表明,在SN-9(5A1-Zn)焊料顶部形成的腐蚀产物的小型深沟形状,而形成在Sn-Cu和SAC305焊料合金顶部的紧密堆积和松散堆叠产物的两个独特结构。相分析揭示了各种腐蚀产物的形成,如SnO和SnO2主要在1M盐酸(HCl)中电位极化后的焊剂合金表面上。

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