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EMC design modifications to solve field failure due to ESD - A case study

机译:EMC设计修改以解决ESD导致的现场故障 - 以案例研究

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One of the major challenges faced by the electronic product designers is to qualify their product for Electrostatic Discharge (ESD) phenomena. This paper discusses a case study of ESD phenomena and recurrent field failures in a consumer electronics product and the solution to the problem. In this paper, the circuit level EMC design modifications that were suggested / implemented to improve the immunity of the product to static electricity discharges are presented. In addition, techniques of shielding the PCB, found necessary to improve the ESD immunity of the product for radiated ESD events, are also presented.
机译:电子产品设计人员面临的主要挑战之一是符合静电放电(ESD)现象的产品。本文讨论了对消费电子产品的ESD现象和反复现场故障的案例研究和解决问题的解决方案。在本文中,提出了建议/实施以改善产品的免疫力的电路电平EMC设计修改。此外,还介绍了屏蔽PCB的技术,发现发现用于改善辐射ESD事件的产品的ESD免疫力。

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