首页> 外文会议>Conference on frontiers in ultrafast optics: biomedical, scientific, and industrial applications XVII >Latest Advances in Machining of Transparent, Brittle Materials Using Non-ablative Femtosecond Laser Processing from Spectra-Physics
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Latest Advances in Machining of Transparent, Brittle Materials Using Non-ablative Femtosecond Laser Processing from Spectra-Physics

机译:使用来自光谱物理学的非烧蚀飞秒激光加工的透明,脆性材料加工的最新进展

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Non-ablative, femtosecond laser process ClearShape? from Spectra-Physics? for cutting transparent, brittle materials is based on producing a micron-sized material modification track with well-defined geometry. Although this process allows cutting by using relatively low average power of 4 W, for further improvement of the process we have studied how to make an efficient usage of higher average power and higher pulse energy available from an industrial femtosecond laser systems. In this paper, we give an overview of the machining results obtained using femtosecond Spirit? HE. The high average power (>16 W) and high pulse energy (>120 μJ/pule) from Spirit HE allow us to achieve unprecedented cutting speed and quality for wide variety of transparent, brittle materials.
机译:非烧蚀,飞秒激光过程清除形式吗?从光谱物理学?为了切割透明,脆性材料基于产生具有明确定义几何形状的微米尺寸材料改性轨道。尽管该过程允许通过使用相对较低的4 W的平均功率切割,但是为了进一步改进,我们研究了如何利用工业飞秒激光系统可获得更高平均功率和更高脉冲能量的方法。在本文中,我们概述了使用飞秒精神获得的加工结果?他。来自Spirit的高平均电力(> 16次)和高脉冲能量(>120μJ/ pule),他允许我们为各种透明,脆性材料实现前所未有的切割速度和质量。

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