Sub-THz interconnect for planar chip-to-chip communications

摘要

This paper presents both microstrip line based and dielectric waveguide based sub-THz interconnect for high energy efficiency and high bandwidth density chip-to-chip communications. The data rates of microstrip line based interconnect with 0.06-dB/mm channel loss and dielectric waveguide based interconnect with 0.04-dB/mm channel loss are up to 12.2 Gb/s and 12.1 Gb/s, respectively. The highest energy efficiency and bandwidth density achieved are up to 0.32 pJ/b and 100 Gb/s/mm2.