Holographic optical interconnect system and method for board-to- board and chip-to-chip communication interconnections

摘要

A holographic optical interconnect system (100) and method (200) provide flexible, efficient interconnection of a plurality of circuit boards CBs and a plurality of integrated circuit chips. Each CB has at least an optically transparent substrate OTS mate parallel to the CB and extending outside a CB holder. Each OTS mate has parallel sides and carries at least two holographic optical elements HOEs. A first one of the HOEs on a first OTS mate reflects at least a predetermined portion of a first light beam transmitted by a transmitter on a corresponding CB to another HOE, which transmits a received light beam via free space outside the CB holder. On another OTS mate, two HOEs are utilized to receive and direct at least part of the light beam received to a detector on a corresponding CB via free space within the circuit board holder or reflection within the OTS mate.