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Low growth temperature MOCVD InGaP for multi-junction solar cells

机译:低生长温度MOCVD用于多结太阳能电池的MOCVD INGAP

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In view of the realization of high efficiency four-junction solar cells, InGaP layers, lattice matched to InGaAs, and (001) 6° off Ge substrate are grown by low pressure MOCVD at growth temperatures as low as 500 °C. The grown samples are undoped, p-type (doped by Zn) and n-type (doped by Te) materials with thickness around 1 μm. The ternary compound composition and structural properties are analysed by High Resolution X-Ray Diffraction and Transmission Electron Microscopy (TEM). Completely disordered InGaP layers are obtained with a target energy gap above 1.88 eV and a controlled Zn concentration around 10~(17) cm~(-3). The interface properties are studied by High Resolution TEM. A nanometric scale waviness is observed at the interface between InGaP and InGaAs and it is correlated to the step bunching of the substrate offcut. In addition to this, HRTEM shows a 2-3 nanometer thin layer originated by atomic interdiffusion between the As-and the P-based compounds. The difference in composition of this interdiffusion layer is demonstrated by depth resolved Cathodoluminescehce (CL), which reveals-approaching the InGaP/LiGaAs interface, a blue shift of the InGaP related peak and the appearance of a new CL emission band ascribed to a quaternary InGaAsP compound.
机译:考虑到实现高效四结太阳能电池,InGaP层,与IngaAs匹配的晶格,和(001)6°OFF Ge衬底的生长温度低至500℃的低压MOCVD。生长的样品未掺杂,p型(掺杂Zn)和n型(Te)材料,厚度约为1μm。通过高分辨率X射线衍射和透射电子显微镜(TEM)分析三元化合物组合物和结构性质。通过高于1.88eV的目标能量间隙获得完全混乱的InGaP层,并且受控Zn浓度约为10〜(17)cm〜(-3)。接口属性由高分辨率TEM研究。在Indap和InGaAs之间的界面中观察到纳米垢波纹,并且与基板脱机的台阶捆绑相关。除此之外,HRTEM显示出源于AS和P型化合物之间的原子互连的2-3纳米薄层。该间隔层的组成差异通过深度分辨的阴离子肿大(CL)来证明,其揭示了InGaP / Ligaas界面,Indap相关峰的蓝色偏移以及归因于第四纪IngaAsp的新CL发射带的外观化合物。

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