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Characterization and Comparison of Planar and Trench Silicon Carbide (SiC) Power MOSFETs

机译:平面和沟槽碳化硅(SiC)功率MOSFET的表征及比较

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摘要

This paper presents a comprehensive evaluation and experimental comparison of silicon carbide power MOSFETs through double pulse test. First, a universal hardware platform is designed and developed to test power semiconductor devices with various device packages and measuring requirements. Using the developed platform, the static characteristics and switching performance of the two types of SiC MOSFETs (one planar and one trench type) are evaluated under different case temperatures from 25°C to 175°C. Based on the evaluation data, a comparison of both SiC MOSFETs is conducted in terms of their on-state resistance, switching loss, and temperature dependent behavior. It is found that the latest trench SiC MOSFETs present similar switching loss while much lower conduction loss compared to existing commercial planar SiC MOSFETs. Moreover, the trench devices show a nearly temperature independent switching loss, which is beneficial to suppress the potential thermal runaway issue under high temperature continuous operation.
机译:本文通过双脉冲测试介绍了碳化硅功率MOSFET的综合评价和实验比较。首先,设计和开发了一个通用硬件平台,以测试具有各种设备封装和测量要求的功率半导体器件。使用开发的平台,在从25°C至175°C的不同情况温度下评估两种类型的SiC MOSFET(一个平面和一个沟槽类型)的静态特性和切换性能。基于评估数据,两个SIC MOSFET的比较是在其导通电阻,开关损耗和温度依赖行为方面进行的。发现最新的沟槽SiC MOSFET存在类似的开关损耗,而与现有的商业平面SiC MOSFET相比,导通损耗大得多。此外,沟槽装置显示出几乎温度的独立开关损耗,这有利于在高温连续操作下抑制潜在的热失控问题。

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