Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package

Zhiqiang Wang; Fei Yang; Steven L. Campbell; Madhu Chinthavali

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Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package

机译：低电感功率模块封装中的SiC沟道MOSFET的特性

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摘要

This paper evaluates the temperature-dependent static and switching characteristics of SiC Trench

机译：本文评估了SiC沟道的温度相关静态和开关特性

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来源
《IEEE Transactions on Industry Applications》 |2019年第4期|4157-4166|共10页
作者
Zhiqiang Wang; Fei Yang; Steven L. Campbell; Madhu Chinthavali;
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作者单位

Power Electronics and Electric Machinery Center Oak Ridge National Laboratory Knoxville TN USA;

Department of Electrical Engineering and Computer Science The University of Tennessee Knoxville TN USA;

Power Electronics and Electric Machinery Center;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
MOSFET; Silicon carbide; Multichip modules; Temperature; Switches; Logic gates; Inductance;

机译：MOSFET;碳化硅;多芯片模块;温度;开关;逻辑门电感;
入库时间 2022-08-18 04:35:09

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1. All-SiC Modules with 2nd-Generation SiC Trench Gate MOSFETs [J] . Fuji electric review . 2019,第4a267期

机译：具有第2代SIC沟槽栅极MOSFET的全SIC模块
2. All-SiC Modules Equipped with SiC Trench Gate MOSFETs [J] . NAKAZAWA Masayoshi, DAICHO Norihiro, TSUJI Takashi Fuji electric review . 2017,第4a259期

机译：All-SiC模块配有SiC Trench栅极MOSFET
3. 3.3-kV All-SiC Module with Trench-Gate MOSFETs for Electric Distribution Equipment [J] . KANAI Naoyuki, HOYA Masashi, TSUJI Takashi Fuji electric review . 2018,第4a263期

机译：3.3-kV全版本模块，带有沟槽栅极MOSFET用于配电设备
4. Development of a low-inductance SiC trench MOSFET power module for high-frequency application [C] . Zhiqiang Jack Wang, Fei Yang, Steven Campbell, IEEE Applied Power Electronics Conference and Exposition . 2018

机译：开发用于高频应用的低电感SiC沟槽MOSFET电源模块
5. Electrical passivation of 6H-alpha SiC by thermal oxidation and its characterization and application in SiC MOSFETs. [D] . Kang, Soon Won. 1996

机译：6H-αSiC的热氧化电钝化及其表征和在SiC MOSFET中的应用。
6. Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication Characterization and Application [O] . Rui Li, Yufan Wang, Cheng Zhang, 2020

机译：用于弹电模块包装的非线性电导率环氧/ SIC复合材料：制造表征和应用
7. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging [O] . Fengze Hou, Wenbo Wang, Rui Ma, 2020

机译：扇出面板级PCB嵌入式SIC电源MOSFET包装

Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package

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