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On the manipulation of phosphorus diffusion as well as the reduction of specific contact resistivity in Ge by carbon co-doping

机译:碳共掺杂的磷扩散的操纵及降低GE的特定接触电阻率

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In this work, the manipulation of phosphorus diffusion as well as the reduction of the specific contact resistivity in Ge by carbon co-doping is explored. It is found that there is an optimum condition for carbon implantation to suppress the rapid P diffusion effectively. For such a condition, the implanted carbon sits at the half range of the pre-amorphized Ge layer. In this case, both the diffusion of P in the amorphous layer and in the Ge virtual substrate beyond the amorphous/crystal (a/c) interface can be effectively manipulated. Except the control of P diffusion, the specific contact resistivity (ρ_c) between as-formed NiGe and the Ge substrate in the presence of C can be also reduced, compared with the reference without C. At 500°C germanidation temperature, the pc values are reduced from 1.1×10~(-4) Ω-cm~2 and 2.9×10~(-5) Ω-cm~2 for NiGe/n- and p-Ge contacts without carbon to 7.3×10~(-5) Ω-cm~2 and 1.4×10~(-5) Ω-cm~2 for their counterparts with carbon, respectively.
机译:在这项工作中,探讨了磷扩散的操纵以及通过碳共掺杂的Ge中的特定接触电阻率降低。发现有效地存在碳植入的最佳条件,以有效地抑制快速P扩散。对于这样的条件,植入碳坐在预先定位的Ge层的半范围内。在这种情况下,可以有效地操纵P在非晶层中的P中的P的扩散和超出非晶/晶体(A / C)界面的Ge虚拟基板。除了P扩散的控制之外,与不含C的参考值相比,也可以减少在C的C型Nige和Ge底物之间的特定接触电阻率(ρ_c)。在500℃的恐惧温度下,PC值用于NigE / N-和P-GE接触器的1×10〜(-4)Ω-cm〜2和2.9×10〜(-5)Ω-cm〜2,无碳为7.3×10〜(-5分别为碳的ω-cm〜2和1.4×10〜(-5)ω-cm〜2。

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