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Combining in situ tensile testing and orientation microscopy in the SEM: A MEMS based setup for studying time dependent deformation of thin films by TKD and STEM

机译:在SEM中的原位拉伸测试和方向显微镜中组合:一种基于MEMS基于TKD和茎的薄膜时间依赖变形的设置

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摘要

Structures in integrated devices are constantly subjected to residual or thermal stresses during operation. Understanding the relaxation behavior of thin films is therefore critical for improving their reliability. Recently it was shown that Transmission Kikuchi Diffraction (TKD) in the Scanning Electron Microscope (SEM) enables the determination of local crystal orientations with high spatial resolution using standard Electron Backscatter Diffraction (EBSD) instrumentation [1, 2].
机译:在操作期间,集成装置中的结构恒定地经受残留或热应力。因此,了解薄膜的放松行为对于提高其可靠性至关重要。最近,显示扫描电子显微镜(SEM)中的传输Kikuchi衍射(TKD)能够使用标准电子反向散射(EBSD)仪器[1,2]来确定具有高空间分辨率的局部晶体取向[1,2]。

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