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Preparation of Silicon Carbide Coating Layer by Fluidized Bed Chemical Vapor Deposition Using A Halogen-Free Precursor

机译:流化床化学气相沉积使用无卤素前体制备碳化硅涂层

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Tristructural-isotropic (TRISO) particle, with spherical ceramic fuel particle kernels followed by three layers of pyrolytic carbon and one layer of silicon carbide (SiC), has been successful now in high temperature gas cooled reactor (HTGR). The silicon carbide (SiC) layer used in TRISO coated fuel particles is normally produced at high temperatures (~1600°C) via fluidized bed chemical vapor deposition from methyltrichlorosilane (MTS) in a hydrogen environment. The precursor is strong corrosive and the process is not environmentally friendly. In this work, hexamethyldisilane (HMDS) was used instead of MTS and the deposition behavior was investigated via fluidized bed chemical vapor deposition method. Different experimental parameters were tested, such as deposition temperature (800~1450°C) and gas flow ratio of Ar: H_2. The deposition rates were obtained and compared. It was found that the optimization parameters of highest deposition rate is 1000°C with the ratio of Ar: H_2 of 1:1. The microstructures of the products were further investigated by SEM, XRD and Raman scattering. From the X-ray diffraction pattern it could be inferred that the p-SiC phase was obtained, and free carbon was also found in deposition products. Different types of SiC layer, including dense and porous layer can be prepared. The experimental results validated that HMDS was an alternative precursor for preparing the SiC layer in producing the TRISO particle and other SiC-coated materials in lower temperatures.
机译:具有球形陶瓷燃料颗粒粒跟随三层热解碳和一层碳化硅(SiC),现在在高温气体冷却反应器(HTGR)中取得了一层纤溶碳颗粒和一层碳化硅粒子。在Triso涂覆的燃料颗粒中使用的碳化硅(SiC)层通常在高温(〜1600℃)的高温下通过流化床化学气相沉积在氢气环境中的甲基三氯硅烷(MTS)。前体是强烈的腐蚀性,过程不对环保。在这项工作中,使用六甲基二硅烷(HMDS)代替MTS,并通过流化床化学气相沉积法研究沉积行为。测试不同的实验参数,例如沉积温度(800〜1450℃)和Ar:H_2的气体流量比。获得并比较沉积速率。发现最高沉积速率的优化参数为1000℃,AR:H_2为1:1。通过SEM,XRD和拉曼散射进一步研究了产品的微观结构。从X射线衍射图案中,可以推断获得p-SiC相,并在沉积产物中发现游离碳。可以制备不同类型的SiC层,包括致密和多孔层。实验结果验证了HMDS是制备在较低温度下制备三孔颗粒和其他SiC涂覆材料时的SiC层的替代前体。

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