The Role of Fluorosurfactant on Cu-Sn Electrodeposition from Methanesulfonic Acid

摘要

Methanesulfonic acid (MSA) is an environmentally benign supporting electrolyte that is an attractive alternative to traditional copper and tin plating baths based on cyanide or fluoborate. This is mainly due to its low toxicity, volatility, and good biodegradability as well as other desirable characteristics for electrodeposition such as high metal salt solubility and conductivity. The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid was explored through the use of an electrochemical quartz crystal nano-balance to monitor surfactant adsorption and desorption from the electrode surface. It was found that the surfactant adsorbs on the surface and inhibits copper deposition by blocking the reduction and oxidation reaction for copper.