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The Silicon Plates In Buried Oxide For Enhancement Of The Breakdown Voltage In SOI MESFET

机译:掩埋氧化物中的硅板,用于提高SOI MESFET中的击穿电压

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This paper introduces a novel SOI MESFET which enhancement breakdown voltage (VBR) by modifying electric field distribution. To achieve high enhancement of the VBR utilized three Silicon plates in buried oxide of the silicon on insulator metal semiconductor field effect transistor (SOI MESFET). This change in the SOI MESFET structure leads to controlled electric field distribution, increase VBR and Output Resistance (RO). The numerical simulation results show that the VBR of the Silicon Plates SOI MESFET (SP-SOI MESFET) structure improves by 50% compared with that of the conventional SOI MESFET (C-SOI MESFET) structure. As a result, the SP-SOI MESFET structure has superior electrical performances in comparison with the conventional structure.
机译:本文介绍了一种通过改变电场分布来增强击穿电压(VBR)的新型SOI MESFET。为了实现高增强VBR,在绝缘体金属半导体场效应晶体管(SOI MESFET)上使用三个硅板。 SOI MESFET结构的这种变化导致受控电场分布,增加VBR和输出电阻(RO)。数值模拟结果表明,与传统SOI MESFET(C-SOI MESFET)结构相比,硅板SOI MESFET(SP-SOI MESFET)结构的VBR提高了50%。结果,与传统结构相比,SP-SOI MESFET结构具有优异的电气性能。

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