Reflow Profile Repeatable and Consistency Analysis

摘要

With the rapid development of the electronics industry, highly integrated, highly reliable PCBA design has become the industry's new trend. Driven by this trend, SMT reflow soldering as a major process for surface mount technology, its reflow profile parameters setting is often the focus of attention, but the repeatability (stability) lacks attention during the transformation from product design Stage to the mass production, it will be undoubtedly a fatal blow to the performance and quality of product itself once happened variation. In this paper, we will introduce the difference between the reflow profile of the product in the mass production stage and the reflow profile in the design stage. Through analyzing and verifying the preliminary reason to the root cause, confirm that the performance of the reflow oven cooling zone is the main factor, it will directly affect profile repeatability. After improvement, the consistency of the reflow profile is finally achieved.