Preparation of RPSL-02 Type Photosensitive Resin for Stereolithography Material and Investigation on Its Some Properties

摘要

RPSL-02 type photosensitive resin for stereolithography material was prepared with 3, 4-epoxycyclohexylmethyl-3', 4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), trimethyolpropane triacrylate (TMPTA), polycaprolactone polyol (polyol-0301), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 395mPa·S, The glass transition temperature (Tg) of the UV-cured specimen was 52°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).