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Carbonization of Si Surface Using Hot-Filament CVD Equipment and Characterization of the Char Layer

机译:使用热丝CVD设备的Si表面碳化和Char层的表征

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To date, many studies have been carried out to investigate the use of semiconductive diamonds in industrial applications. In these studies, it has been necessary to deposit high-quality crystalline diamond thin films on large-area substrates. Hot-filament chemical vapor deposition (HFCVD) has been a useful method for generating these thin films. While large-area silicon (Si) substrates are easily obtainable and inexpensive and Si is a suitable material for the deposition of diamond thin films, because of the large mismatch of the lattice constants of Si and diamond, it is usually difficult to grow epitaxial diamond films on Si substrates. Therefore, insertion of a buffer layer comprised of a material with a lattice constant between those of Si and diamond is required. Silicon carbide (SiC), which is readily obtained by carbonization of the Si surface, is a candidate material for such a buffer layer. Therefore, in this study, a char layer was formed on a Si surface using HFCVD equipment and analyzed from various perspectives.
机译:迄今为止,已经进行了许多研究以研究工业应用中的半导体钻石的使用。在这些研究中,有必要在大面积基板上沉积高质量的结晶金刚石薄膜。热丝化学气相沉积(HFCVD)是产生这些薄膜的有用方法。虽然大面积硅(Si)衬底易于获得,并且廉价且Si是用于沉积金刚石薄膜的合适材料,因此由于Si和金刚石的晶格常数的大错位,通常难以生长外延金刚石SI基板上的电影。因此,需要在Si和金刚石之间插入包含具有晶格常数的材料的缓冲层。通过Si表面碳化容易地获得的碳化硅(SiC)是用于这种缓冲层的候选材料。因此,在该研究中,使用HFCVD设备在Si表面上形成炭层并从各种透视分析。

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