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Influence of ion implantation in SiC on the channel mobility in lateral n-channel MOSFETs

机译:SiC在横向N沟道MOSFET中SiC在SiC中的影响

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In this work, the impact of ion implantation into the MOSFET channel region on the channel mobility of electrons is investigated. For this purpose, a systematic investigation of the interface trap density, the interface trapped charge and the field-effect mobility is carried out for MOSFETs with different doping profiles and concentrations in the channel region. It will be demonstrated that implantation into the SiC MOSFET channel does not increase the amount of bulk defects. It leads, however, to a change of the doping concentration, and consequently of the bulk potential (Φ_B). The latter crucially determines the amount of charged interface states, and as a result, represents one determining factor for the channel electron mobility. The experimental data indicates that bulk traps as suggested by Agarwal and Haney (1), are insufficient to explain the low electron mobility in SiC MOSFET inversion channels.
机译:在这项工作中,研究了离子注入到电子对电子信道移动性的MOSFET通道区域中的影响。为此目的,对界面陷阱密度,接口被捕获的电荷和场效应移动性的系统研究是针对具有不同掺杂曲线的MOSFET和沟道区域中的浓度的MOSFET进行的。将说明植入到SiC MOSFET通道中不会增加散装缺陷的量。然而,它导致掺杂浓度的变化,并且因此对散装电位(φ_B)的变化。后者致命地确定带电界面状态的量,结果表示信道电子迁移率的一个确定因素。实验数据表明,如琼脂和Haney(1)所示的大量陷阱不足以解释SiC MOSFET反转通道中的低电子移动性。

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