The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids (PPT)

摘要

Tin/Lead BGAs: The location of the woid within the solder joint was the primary root cause for the loss of solder Joint integrity. Lead-free BGAs: The statistical analysis and the metallographic cross-sectional analysis results revealed that the presence or size of the solder Joint voids did not correlate to the loss of lead-free solder Joint integrity. A single set of BGA solder joint woid process control limits is applicable for both tin/lead and lead-free BGA solder joints.