首页> 外文学位 >3D modeling of void nucleation and initial void growth due to Tin diffusion as a result of electromigration in polycrystalline lead-free solders.

【24h】

3D modeling of void nucleation and initial void growth due to Tin diffusion as a result of electromigration in polycrystalline lead-free solders.

机译：多晶无铅焊料中电迁移导致锡扩散引起的空洞成核和初始空洞生长的3D模型。

获取原文

获取原文并翻译 | 示例

页面导航

著录项
相似文献
相关主题

著录项

作者
Karunakaran, Deepak.;
展开▼
作者单位

Arizona State University.;

展开▼
授予单位 Arizona State University.;
学科 Materials science.;Electrical engineering.
学位 M.S.
年度 2016
页码 48 p.
总页数 48
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. Modeling ductile fracture in metals involving two populations of voids - Influence of continuous nucleation of secondary voids upon growth and coalescence of primary voids [J] . Enakoutsa K. Mathematics and mechanics of solids: MMS . 2013,第3期

机译：模拟涉及两个孔隙的金属中的韧性断裂-次级孔隙的连续成核对初级孔隙的生长和聚结的影响
2. A finite element model of electromigration induced void nucleation, growth and evolution in interconnects [J] . Bower AF, Shankar S Modelling and simulation in materials science and engineering . 2007,第8期

机译：电迁移引起互连中空洞成核，生长和演化的有限元模型
3. Void nucleation and growth in irradiated polycrystalline metals: a phase-field model [J] . Millett PC, Rokkam S, El-Azab A, Modelling and simulation in materials science and engineering . 2009,第6期

机译：辐照多晶金属中的空泡形核和生长：相场模型
4. Modeling Nucleation and Growth of Voids During Electromigration [C] . David Richards, James B. Adams, Len Borucki 1999 International Conference on Modeling and Simulation of Microsystems Apr 19-21, 1999, San Juan, Puerto Rico, USA . 1999

机译：模拟电迁移过程中空隙的成核和生长
5. Direct measurement of nucleation times and growth rates of electromigration-induced voids. [D] . Doan, Jonathan Clayton. 1999

机译：直接测量电迁移引起的空洞的成核时间和增长率。
6. Voided volume < 150 mL on initial uroflowmetry in men with storage symptoms: Is it an unreliable test result or a sign of severe storage symptoms? [O] . Sangjun Yoo, Youkyung Lee, Juhyun Park, 2012

机译：患有尿毒症症状的男性在最初的尿流仪上的空隙体积<150 mL：这是不可靠的测试结果还是严重的尿毒症症状的征兆？
7. On void nucleation and growth in metal interconnect lines under electromigration conditions [O] . Nix William D., Arzt Eduard 1992

机译：在电迁移条件下金属互连线中的空核和长大

3D modeling of void nucleation and initial void growth due to Tin diffusion as a result of electromigration in polycrystalline lead-free solders.

著录项

相似文献

相关主题

期刊订阅