RISK FOR CERAMIC COMPONENT CRACKING DEPENDENT ON SOLDER ALLOY AND THERMO-MECHANICAL STRESS

摘要

New solder alloy development for high temperature applications have increased the last few years; for example, automotive applications now use both Innolot and/or HT1 alloys, especially when the devices have to work at temperatures up to 170°C. For the solder alloy and the interconnection itself, there are some fatigue life advantages when using Innolot, especially for thermal cycles -40/+150°C. On the other hand, by using Innolot there is a relatively high thermo-mechanical stress induced which can create ceramics defects at the passive components. The paper will compare and discuss the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses based on the finite element method.