VACUUM REFLOW PROCESSING OF BALL GRID ARRAY PACKAGES TO REDUCE SOLDER JOINT VOIDING AND IMPROVE ATTACHMENT RELIABILITY

机译：球栅阵列套件的真空回流处理减少焊点空隙，提高附着可靠性

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A daisy chained ball grid array test vehicle is used to compare the voiding and attachment reliability of convection assembly and vacuum assembly. Transmission x-ray inspection shows substantially lower void content with vacuum assembly. Accelerated thermal cycling (ATC) is used to assess the solder attachment reliability of the air and vacuum reflowed test vehicles. The thermal cycling results are discussed in terms of the better thermal fatigue performance with vacuum processing, the evolving industry standards for solder voiding, and suggestions for additional work.

机译：用于比较对流组件和真空组件的空隙和附着可靠性的雏菊链式球栅阵列。传输X射线检测显示基本上更低的空隙含量与真空组件。加速热循环（ATC）用于评估空气和真空回流试验车辆的焊料附着可靠性。热循环结果是在具有真空加工的更好的热疲劳性能方面讨论了焊剂排尿的不断发展的行业标准，以及用于额外工作的建议。

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来源
《Surface Mount Technology Association International Conference》|2019年|1(CD-ROM)|共10页
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作者
Richard Coyle; Charmaine Johnson; Tim Pearson; Dave Hillman; Michael Meilunas; Fred Dimock; Richard Popowich; Bob Bouchard; Richard Parker; Keith Howell; Jorg Trodler; Arvind Karthikeyan; Elizabeth Barr;
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原文格式 PDF
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中图分类 TN41-53;
关键词
Solder joint voiding; Vacuum reflow processing; Thermal fatigue reliability; Thermal cycling; Lead-free alloys;

机译：焊点空洞;真空回流处理;热疲劳可靠性;热循环;无铅合金;

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专利

1. Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints [J] . W.H. Zhong, Y.C. Chan, M.O. Alam Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2006,第1a2期

机译：多次回流工艺对球栅阵列（BGA）焊点可靠性的影响
2. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB) [J] . Depiver Joshua A., Mallik Sabuj, Amalu Emeka H. Journal of Electronic Materials . 2021,第1期

机译：用于在印刷电路板（PCB）上焊接的球栅阵列（BGA）中焊点的热机械可靠性的有效焊料
3. Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method [J] . Lau C.-S., Abdullah M.Z., Khor C.Y. Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2013,第3期

机译：基于灰色的Taguchi方法优化球栅阵列包装中具有多种质量特征的回流焊接工艺
4. VACUUM REFLOW PROCESSING OF BALL GRID ARRAY PACKAGES TO REDUCE SOLDER JOINT VOIDING AND IMPROVE ATTACHMENT RELIABILITY [C] . Richard Coyle, Charmaine Johnson, Tim Pearson, SMTA International Conference . 2020

机译：球栅阵列套件的真空回流处理减少焊接关节排尿，提高附着可靠性
5. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003

机译：用共晶铅锡和无铅焊料对塑料球栅阵列，芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
6. Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints [O] . Jiajie Fan, Jie Wu, Changzhen Jiang, 2020

机译：随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
7. A Design Method for Estimating the Reliability of Lead Free Solder Joints in Ball-Grid-Array-Type Packages under Impact Load [O] . Akihiro YAGUCHI, Munehiro YAMADA, Kenichi YAMAMOTO 2003

机译：抗冲击载荷下球栅阵列型包装中无铅焊点可靠性的设计方法

VACUUM REFLOW PROCESSING OF BALL GRID ARRAY PACKAGES TO REDUCE SOLDER JOINT VOIDING AND IMPROVE ATTACHMENT RELIABILITY

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