首页> 外文会议>International Workshop and Conference on Nanotechnology >Preparation and Thermal Stability Characterization of Copper Tin Selenide Semiconductor Nanoparticles
【24h】

Preparation and Thermal Stability Characterization of Copper Tin Selenide Semiconductor Nanoparticles

机译:铜锡硒半导体纳米粒子的制备和热稳定性表征

获取原文

摘要

Copper tin selenide (Cu_2SnSe_3) nanoparticle powders were successfully synthesized via chemical precipitation method at room temperature. Elemental composition analysis determined by energy dispersive X-ray confirmed that the Cu_2SnSe_3 nanoparticles were successfully formed. Field emission scanning electron and transmission electron micrograph showed the presence of homogeneous distribution of the small spherical nanoparticles in the Cu_2SnSe_3 powders. The thermal stability of the Cu_2SnSe_3 structure has been investigated by X-ray diffraction at temperatures ranging from 100 to 523 K. Differential scanning calorimetry and thermogravimetric analysis have been conducted to evaluate the thermal stability and it is found that the maximum temperature of the Cu_2SnSe_3 nanoparticles can withstand until 600 K. The results show that Cu_2SnSe_3 nanoparticles exhibited a stable structure at temperature range of 100 - 523 K.
机译:在室温下通过化学沉淀法成功地合成了铜锡硒(Cu_2SNSE_3)纳米粒子粉末。通过能量分散X射线测定的元素组成分析证实Cu_2SNSE_3纳米颗粒被成功形成。场发射扫描电子和透射电子显微照片显示CU_2SNSE_3粉末中小球形纳米颗粒的均匀分布。已经通过100至523k的温度下通过X射线衍射研究了Cu_2SNSe_3结构的热稳定性。已经进行了差示扫描量热法和热重分析以评估热稳定性,发现Cu_2SNSE_3纳米颗粒的最大温度可以承受直至600 K.结果表明,Cu_2SNSE_3纳米颗粒在100-523k的温度范围内表现出稳定的结构。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号