High power LED packaging materials and tooling

摘要

The high power light emitting diodes unit internal structure was elaborated frommaterials and tooling point of view, the unit matrix frame layout for mass production was presentedfor copper sheet stamping. The tooling stations were decomposed and optimized for packagingprocesses. The optical lens body molding cavity layout was proposed for unit matrix transfermolding. The packaging materials and tooling was analyzed from the materials processes andautomatic stamping & transfer molding. Design scheme for packaging materials processes can bereferenced for high power LED unit devices.