Research and Design of Optical-fiber-embedded Structure in Optical Printed Circuit Board under Thermal Shock

摘要

To improve the serviceability of embedded optical fiber in OPCB, the paper discussed the optical-fiber-embedded structure in OPCB from the aspects of stress. Firstly, discussed optical fiber, groove and whether to use filler and provided six kinds of embedded structures. Then, finite element models were built for thermal simulation and thermal stress in fiber was calculated. Finally, compared different embedded structures from the stress in fiber and gave some suggestion about the design of embedded structure. The study proved that glass fiber is a better selection for OPCB; the stress concentrate easily appears in the edge of glass fiber; using filler can protect uncoated glass fiber, but increase the thermal stress is in coated glass fiber; when embedding uncoated fiber, U-groove is a better choice; when embedding coated fiber, U-groove without filler is the best choice. The results are helpful to the application of glass fiber in OPCB.