THERMAL DESIGN SIMULATION SUPPORT METHOD OF MULTILAYERED PRINTED CIRCUIT BOARD AND THERMAL DESIGN SIMULATION SUPPORT PROGRAM OF MULTILAYERED PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a thermal design simulation support method and a thermal design simulation support program for a multilayered printed circuit board, which are capable of generating a simulation model allowing a thermal influence to be accurately predicted.;SOLUTION: The program takes out information of wiring patterns 11a to 11h, through holes 12a to 12l, heat generation sources 13a and 13b, resin 14a to 14d, etc. included in first to fourth layers 10a to 10d of the multilayered printed circuit board, from a data file being in a two-dimensional CAD format and adds information required for thermal design simulation, such as materials and dimensions to the taken-out information to generate a simulation model. This program is utilized to perform a model generating work.;COPYRIGHT: (C)2005,JPO&NCIPI