Influence of Na_2CO_3 on Thermal Degradation Process of Waste Printed Circuit Board in Air Atmosphere

摘要

The influence of Na_2CO_3 on RF4-type waste printed circuit board (PCB) thermal degradation process in air atmosphere was studied with thermogravimetric analysis, and the reaction kinetics was calculated based on the Coats - Redfern method. It is shown that the weight loss process of WPCB in air atmosphere includes three stages. Addition of Na_2CO_3 decreases the initial temperature of the first weight loss stage of WPCB, which indicates the enhancement effect on the decomposition of the flame retardant. Addition of Na_2CO_3 increases the initial temperature of the second and third weight loss stage of WPCB, which indicates the obstruction effect on oxidation reaction. From the different mechanism function, the optimal mechanism function is f(α)=2/3(1-α)[-ln(1-α) ]~3 and the range of activation energy is 30~185 kJ /mol.