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Challenges for the Semiconductor Industry in the 21st Century

机译:21世纪半导体产业的挑战

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The Semiconductor Industry has successfully continued to prosper for over 40 years relying on the planar CMOS process as its backbone after overcoming a multitude of challenges. Scaling has provided all along a path to cheaper, better and faster integrated circuits. In the past 10 years the CMOS process has introduced revolutionary new processes and structures like Strained Silicon, High-K/Metal Gate and Multigate transistors to overcome the fundamental limiting blocks reached by the silicon gate process. Fueled by research of the past decade, new and exciting materials and novel structures are planned to be introduced in CMOS technology in the next 10 years. Furthermore, the industry is on its way to another wafer size conversion and presently equipment capable of processing wafers of 450mm in diameter is under development.
机译:在克服众多挑战后,半导体产业已成功持续到40多年以上依赖平面CMOS过程作为其骨干。缩放沿着便宜,更好,更快的集成电路提供了一直提供的。在过去的10年中,CMOS工艺引入了革命性的新工艺和结构,如紧张的硅,高k /金属栅极和多相晶体管,以克服硅栅极工艺达到的基本限制块。通过对过去十年的研究来推动,计划在未来10年内在CMOS技术中引入新的和令人兴奋的材料和新颖的结构。此外,该行业正在前往另一种晶圆尺寸转换,目前能够在直径下加工450mm的晶片的设备正在开发。

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