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Introduction of New Materials into CMOS Devices

机译:将新材料引入CMOS设备

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With the progress of recent smart society, demand for high-performance low-power CMOS devices becomes stronger and stronger. Corresponding to the situation, the downsizing of CMOS device has been accelerated significantly. In order to solve the problem inherent in the downsizing, new structures and new materials are being aggressively introduced into MOSFETs. They are. for example, nanowire channel, metal/high-k gate stack, metal/silicide source/drain. In this paper, the status of the new material introduction to CMOS devices is described.
机译:随着近期智能社会的进展,对高性能低功耗CMOS设备的需求变得更强大,更强大。对应于情况,CMOS设备的缩小大小明显加速。为了解决缩小化中固有的问题,新的结构和新材料正在被激进入MOSFET中。他们是。例如,纳米线通道,金属/高k栅极堆叠,金属/硅化物源/漏极。在本文中,描述了新材料的状态描述了CMOS器件的介绍。

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