Power Module Packaging currently undergoes severe change: In addition to the classical technologies like soft soldering and thick wire bonding, novel technologies emerge, such as silver diffusion sintering, transient liquid phase bonding / soldering, new bond wire and substrate materials, as well as direct liquid cooling. This all is driven by the need for higher power density, lower cost and improved durability and reliability. Therefore, many new power semiconductor modules have emerged or are under development. This paper aims at providing an overview so that users of power modules can get a better understanding of the suitability of the devices for their intended application and use.
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