Packaging can be challenging for both RF and direct-current (DC) power circuits. For circuits ranging from chip-scale devices to power modules, however, a new packaging option is now available from Remtec (www.remtec.com). The company has merged its thermally and electrically conductive Power Transfer Vias (PTVs) with the core Plated Copper on Thick Film (PCTF) metallization technology. In doing so, Remtec has achieved a miniaturized, high-performance, and cost-effective packaging solution for high-power gallium-nitride (GaN), gallium-arsenide (GaAs), silicon (Si), and silicon-carbide (SiC) devices (see figure).
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