Deformation Measurements during Active Operation of Power Modules with Novel Assembly and Packaging Technology

摘要

This work shows a study of the mechanical behaviour of the semiconductor and the supporting structures in power modules during operation using optical measurement techniques. Different operating conditions (ton, toff, IC, VGE) are compared to identify the in-plane strain and out-of-plane curvature. The results are correlated with thermographic images in order to show dependencies of the temperature distribution. The results are intended to contribute to a better and fundamental understanding of the thermal-mechanical deformations during active operation. Therefore, electrical parameters, temperatures and displacements are correlated on the basis of the presented in situ test scheme.