Development of Vapor Pressure in FR4-Copper Composite Material during Solder Reflow Process

摘要

This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite material. FE simulation of transient moisture absorption was performed to predict the distribution of wetness fraction in the material after pre-conditioning at an 85°C/85%RH environment for 15 days. FE simulation of transient moisture desorption was carried out at the peak solder reflow temperature of 215°C to predict new distribution of wetness fraction in the material. The results of the moisture desorption analysis were used to compute the magnitude of vapor pressure in the material and its distribution at 215°C. It was found that the moisture in the material redistributes itself during solder reflow. The moisture concentration in the area close to the FR4-copper interface below the longer copper trace increases during the solder reflow. The magnitude of the vapor pressure in 70% of the FR4 and near the FR4-copper interface below the lower copper trace is closed to the saturation pressure of water vapor at 215°C. The distribution of the vapor pressure in the material is in similar fashion as the new distribution of wetness fraction after the moisture desorption analysis.