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Examination of residual stress measurement in electronic packages using phase-shifted sampling moiré method and X-ray images

机译:使用相移采样Moiré方法和X射线图像检查电子包装中的残余应力测量

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This paper examines a novel approach to measure residual stresses in an electronic package. The presented method applies a phase-shifted sampling moire? method to X-ray images of the test chip (Si) in the electronic package. In this study, the test chip including an Au bump grid are made by general semiconductor processes for forming Au bumps on Si chip, and X-ray images of the test chip are taken before and after packaging (resin-molding). Then the phase difference of the sampling moire? fringe patterns before and after packaging can be obtained from the X-ray images of the test chip before and after packaging. The phase difference corresponds to the deformation of the test chip. The results of this examination indicate that the presented method is possible to be used for measuring residual stresses in electronic packages.
机译:本文探讨了一种衡量电子包装中残余应力的新方法。呈现的方法适用相移的采样莫尔?电子包装中测试芯片(SI)的X射线图像的方法。在该研究中,包括Au凸块栅格的测试芯片是由一般的半导体工艺制造的用于在Si芯片上形成Au凸块,并且在包装之前和之后进行测试芯片的X射线图像(树脂模制)。然后是采样莫尔的相位差?包装之前和之后的条纹图案可以从封装之前和之后从测试芯片的X射线图像获得。相位差对应于测试芯片的变形。该检查的结果表明,所提出的方法可以用于测量电子包装中的残余应力。

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