bonding processes; gold; nanoporous materials; shear strength; silver; NPB; bonding condition; electronics industry; gold nanoporous sheet; gold-silver binary alloy; high-temperature bonding process; high-temperature electronic applications; high-temperature lead-free solders; interconnection technology; lead-free interconnection material; nanoporous bonding; nanoporous sheet; nitric acid; no-solvent no-flux solid-state bonding technique; selective element dissolution; shear strength; temperature 350 degC; Bonding; Gold; Joints; Ligaments; Nitrogen; Substrates;
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机译:粘接强度降解对FRP薄片外部加强钢筋混凝土梁柱关节行为影响的数值模拟
机译:金纳米多孔片的结合条件与接头强度之间的关系
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机译:粘合参数对Ag-10au-3.6PD合金键合线自由空气性能和粘结强度的影响
机译:超精细机加工铜扩散粘合数值分析的关节强度和粘结面积的关系。铜扩散粘合研究。报告2。
机译:用于低温共烧陶瓷的au-pt-pd和au厚膜结构的sn-pb焊点的拉伸强度评估mC4652 Crypton编码开关的最终报告(W80)