Study on Thermal Cycling of Sn0.7Cu Solder

摘要

Thermal cycling of a unit Sn0.7Cu solder was studied based on the steady-state creep constitutive equation and Matlab software. The results show that there is a steady-state cycle for the thermal cycling of unit Sn0.7Cu eutectic solder. In steady-state thermal cycling, the shear stress is increased with the increase of temperature. There is a stage of stress relaxation during high temperature. A liner relationship between maximum shear stress and maximum shear strain is observed during thermal cycling. The metastable cycle number is declined greatly with the increase of maximum shear strain.