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A Systematic Study of the Thermoelectric Properties of GaN-based Wide Band Gap Semiconductors

机译:GaN基宽带间隙半导体热电性能的系统研究

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In this paper the thermoelectric properties-the Seebeck coefficient, the electrical conductivity and the power factor - of GaN and InGaN thin films grown by Metal Organic Vapor Deposition (MOCVD) are reported. The Seebeck coefficient and power factor of InGaN decreases with increasing indium content, although the electrical conductivity shows an inverse behavior. P-type doped samples demonstrated the highest Seebeck coefficient (637 μV/K in GaN:Mg, 1200 μV/K in InGaN:Mg) but the lowest power factor (01×10~(-4) W/m-K for GaN:Mg, 0.4×10~(-4)W/m-K for InGaN:Mg). The Seebeck coefficient of the doped GaN thin films decreased linearly with log of the carrier concentration. GaN:Si exhibited a maximum power factor of 9.1×10~(-4) W/m-K with a carrier concentration of 1.6×10~(18) cm~(-3), and In_(0.1)Ga_(0.9)N exhibited a maximum power factor of 109×l0~(-4) W/m-K with a carrier concentration of 1.2×10~(18) cm~(-3). The results also indicate that GaN and InGaN-based materials could potentially be useful materials for TE applications at high temperatures.
机译:本文报道了热电性能 - 塞伯克系数,导电性和由金属有机气相沉积(MOCVD)生长的赤兰薄膜的电导率和功率因数。 InGaN的塞瓦克系数和功率因数随着铟含量的增加而降低,尽管电导率显示了逆行为。 p型掺杂样品显示出最高的塞贝克系数(GaN中的637μV/ k:ingaN:mg中的637μV/ k:mg),但功率因数(01×10〜(-4)W / MK用于GaN:Mg ,0.4×10〜(-4)为IngaN:Mg)。掺杂GaN薄膜的塞贝克系数随载体浓度的日志线性降低。 GaN:Si的最大功率因数为9.1×10〜(-4)W / MK,载体浓度为1.6×10〜(18)cm〜(-3),并且展出了IN_(0.1)GA_(0.9)n最大功率因数为109×L0〜(-4)w / mk,载体浓度为1.2×10〜(18)cm〜(-3)。结果还表明GaN和IngaN的材料可能是在高温下的TE应用的有用材料。

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