R2R process for integrating LEDs on flexible substrate

摘要

Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining hybrid integrated structures with injection overmoulding is introduced in this paper. Contrary to traditional process of overmoulding the electronics label in sheet format, the flexible foil is processed roll-to-roll throughout the full manufacturing chain providing high-efficiency manufacturing. The paper discusses the manufacturing process development and results with a manufacturing trial of demonstrator processed in roll-to-roll hybrid manufacturing with good yield.