Graphene-based Heat Spreading Materials for Electronics Packaging Applications

摘要

Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based electrically conductive adhesive (G-CA), were applied to electronics packaging. The thermal performances of GBF and G-CA were analyzed by resistance temperature detector (RTD) and thermal infrared imager. When the chip was covered by GBF and G-CA, the temperature of hotspot could be reduced by 3.1°C, at heat flux of 580 W/cm~2. To analyze the thermal performances of G-CA and GBF in 3D electronics packaging, the distribution of temperature and temperature profiles on the top surface of chip were analyzed by COMSOL. Both of GBF and G-CA could obviously reduce the temperature of hotspot on the top surface of chip, compared with that on the bare chip. With G-CA and GBF, the temperature of hotspot could be reduced by 8°C. It suggests that both of G-CA and GBF are good heat spreading materials for electronics packaging application.